Interspectral and AM Explorer is heading to Formnext 2021, the leading trade fair for Additive Manufacturing

Interspectral will be exhibiting at Formnext 2021 in Frankfurt November 16-19th. Formnext is the leading trade fair for Additive Manufacturing and the next generation of intelligent manufacturing solutions. 

At Formnext Interspectral will present its solution AM Explorer a visualization software package that makes it possible to fuse, explore and analyze simulation, monitoring and post build part analysis data from the metal additive manufacturing process.

“We are eager to meet our partners and the entire international AM community in real life. The demand for solutions making it easier to understand processing monitoring data is growing by the day so we believe that our solution AM Explorer will generate a lot of interest at Formnext. 

Thomas Rydell, CEO at Interspectral

Interspectral will also give visitors to Formnext a glimpse of the future by presenting ongoing work featuring AR applications and a new interactive cloud streaming solution making it possible to work with massive process monitoring data on any device anywhere. 

Please visit our booth 11.0,B7 and book your personal demo here.

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